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Izixhobo zokuhlola ze-SMT

  • JUKI 3D solder umatshini wokuhlola intlama, 3D ibhodi ebonwayo umatshini wokuhlola RV-2-3DH(AOI/SPI)

    JUKI 3D solder umatshini wokuhlola intlama, 3D ibhodi ebonwayo umatshini wokuhlola RV-2-3DH(AOI/SPI)

    Isantya esiphezulu

    Uphuculo olukhulu kubuchule bokuhlola ngepixel ephezulu (izigidi ezili-12 zeepikseli)

    Ukuchaneka okumangalisayo

    Ukusebenzisa iilensi ezinokulungiswa okuphezulu kuphucula ukuchaneka kokuhlolwa kwezixhobo ze-ultra-compact

    Ukulula kokusetyenziswa kokureyitha

    Iindlela zenkqubo ekulula ukuzisebenzisa kunye nokwenza, ukusuka kwabaqalayo ukuya kubantu abadala

    Ukuhlola okuzenzekelayo okuzenzekelayo

    RV series, enokusetyenziswa kwakhona umlinganiselo

    Ukuphucula ukusebenza kakuhle kwesityalo sonke

    Ukuphumeza ukusebenza kakuhle komzi-mveliso uphela ngonxibelelwano lwenkqubo

  • JUKI 3D solder umatshini wokuhlola intlama, 3D umatshini wokuhlola ibhodi ebonakalayo (AOI/SPI) RV-2-3D

    JUKI 3D solder umatshini wokuhlola intlama, 3D umatshini wokuhlola ibhodi ebonakalayo (AOI/SPI) RV-2-3D

    Ukuqonda ukukhawulezisa ngeyunithi yamva nje ye-3D.Ukuphumelela kwe-0.41 sec / FOV kunye ne-34% yokuphucula xa kuthelekiswa nemodeli yangaphambili.

    Isisombululo sobude 0.1 μm, Ukuphindaphindwa kwe-10 μm *Ukuqonda ukuphuculwa okuchanekileyo okuchanekileyo.Ngophuhliso olutsha lweteknoloji, fumana umfanekiso we-3D ocacileyo kunye nochanekileyo.

    Ukongeza kwithempleyithi ye-2D yangaphambili kunye nemo yenkqubo, yongezwe imowudi yetemplate ye-3D entsha.

    Ngapha koko, ukuphuhliswa kwe-algorithm entsha yokuhlolwa kweefayili.* 0402 itshiphu

  • JUKI 3D solder paste wokuhlola umatshini RV-2

    JUKI 3D solder paste wokuhlola umatshini RV-2

    ISixokelelwano esicacileyo sokubamba umbono

    Umgangatho ophezulu wokusebenza kwehlabathi

    Isantya sokuhlola = 0.2 sec / isakhelo

    Udweliso lwenkqubo olulula

    I-CCC ( Ulawulo loQinisekiso olusembindini)*

    I-SPC ( Ulawulo lweNkqubo yoBalo) *

    Ixhasa ukuhlolwa kwe-3D *