JUKI 3D solder umatshini wokuhlola intlama, 3D ibhodi ebonwayo umatshini wokuhlola RV-2-3DH(AOI/SPI)

Iimbonakalo:

Isantya esiphezulu

Uphuculo olukhulu kubuchule bokuhlola ngepixel ephezulu (izigidi ezili-12 zeepikseli)

Ukuchaneka okumangalisayo

Ukusebenzisa iilensi ezinokulungiswa okuphezulu kuphucula ukuchaneka kokuhlolwa kwezixhobo ze-ultra-compact

Ukulula kokusetyenziswa kokureyitha

Iindlela zenkqubo ekulula ukuzisebenzisa kunye nokwenza, ukusuka kwabaqalayo ukuya kubantu abadala

Ukuhlola okuzenzekelayo okuzenzekelayo

RV series, enokusetyenziswa kwakhona umlinganiselo

Ukuphucula ukusebenza kakuhle kwesityalo sonke

Ukuphumeza ukusebenza kakuhle komzi-mveliso uphela ngonxibelelwano lwenkqubo

Ukudibana kwi-Intanethi Qhagamshelana nathi

Iinkcukacha zeMveliso

*1 Oku kunokwenziwa ngokhetho.

Ubungakanani bebhodi		50mm×50mm-410mm×300mm 50mm×50mm-630mm×300mm (isenzo kwibhodi elide)*1
Isisombululo sovavanyo		12μm (isisombululo esiqhelekileyo)/5μm (isisombululo esiphezulu)*1
I-engile yomfanekiso		48.0×36.0mm, 20.0×15.0mm*1
Izinto zokuhlola		Umfutshane, ukucheba, ipolarity, icala-umva, i-solder engafakwanga, ibhulorho, isixa sesoda, ukufakwa kwenxalenye eshiyiweyo, ukuqondwa koonobumba*1
I-FOV (Eyona meko)	2D	0.2sec/1 isikrini
	3D	61.8cm²/umzuzwana