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JUKI 3D solder umatshini wokuhlola intlama, 3D umatshini wokuhlola ibhodi ebonakalayo (AOI/SPI) RV-2-3D ​​Umfanekiso okhoyo

JUKI 3D solder umatshini wokuhlola intlama, 3D umatshini wokuhlola ibhodi ebonakalayo (AOI/SPI) RV-2-3D

Iimbonakalo:

Ukuqonda ukukhawulezisa ngeyunithi yamva nje ye-3D.Ukuphumelela kwe-0.41 sec / FOV kunye ne-34% yokuphucula xa kuthelekiswa nemodeli yangaphambili.

Isisombululo sobude 0.1 μm, Ukuphindaphindwa kwe-10 μm *Ukuqonda ukuphuculwa okuchanekileyo okuchanekileyo.Ngophuhliso olutsha lweteknoloji, fumana umfanekiso we-3D ocacileyo kunye nochanekileyo.

Ukongeza kwithempleyithi ye-2D yangaphambili kunye nemo yenkqubo, yongezwe imowudi yetemplate ye-3D entsha.

Ngapha koko, ukuphuhliswa kwe-algorithm entsha yokuhlolwa kweefayili.* 0402 itshiphu


Qhagamshelana nathi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Igama lemodeli RV-2-3D
Ubungakanani bePWB 50mm×50mm – 410mm×300mm
50mm×50mm – 630mm×300mm (ubukhulu bePWB ende)*
FOV(yeyona ilungileyo) I-P-3D AOI 0.41s / isakhelo
Isisombululo sokuhlolwa 15μm (Uhlaziyo olusemgangathweni), 10μm(isisombululo esiphezulu)*
Isisombululo sokuhlolwa 15μm ( uhlengahlengiso olusemgangathweni), 10μm (isisombululo esiphezulu) *
Into yokuhlola Ilungu elilahlekileyo,Isikhundla sokufuduswa, iPolarity, uMphambili/umva umva, Ingathengiswanga, iBridge, Ubungakanani besolder, Ukunqongophala kwecandelo lofakelo, Ukuqondwa koonobumba*

Iimveliso ezinxulumeneyo

Cofa u-enter ukukhangela okanye i-ESC ukuvala