JUKI 3D solder paste wokuhlola umatshini RV-2

Iimbonakalo:

ISixokelelwano esicacileyo sokubamba umbono

Umgangatho ophezulu wokusebenza kwehlabathi

Isantya sokuhlola = 0.2 sec / isakhelo

Udweliso lwenkqubo olulula

I-CCC ( Ulawulo loQinisekiso olusembindini)*

I-SPC ( Ulawulo lweNkqubo yoBalo) *

Ixhasa ukuhlolwa kwe-3D *

Ukudibana kwi-Intanethi Qhagamshelana nathi

Iinkcukacha zeMveliso

Igama lemodeli			RV-2
Ubungakanani bePWB			50mm×50mm – 410mm×360mm 630mm×360mm(PWB enobungakanani ende)*
Amacandelo			0402* / 0603(metric), I-Cylindrical chip, tantalum capacitor, transistor, SOP / QFP, njl.
FOV(yeyona ilungileyo)	2D		0.2s / isakhelo
	i-3D SPI	2D+3D ukuhlolwa	0.50s / isakhelo (4frame)
	e-3D AOI	2D+3D ukuhlolwa	0.55s / isakhelo (4frame)
Isisombululo sokuhlolwa			15μm (Uhlaziyo olusemgangathweni), 10μm (isisombululo esiphezulu)*
Into yokuhlola			Ilungu elilahlekileyo,Isikhundla sokufuduswa, iPolarity, uMphambili/umva umva, Ingathengiswanga, iBridge, Ubungakanani besolder, Ukunqongophala kwecandelo lofakelo, Ukuqondwa koonobumba*