Kukho iindlela ezimbini eziphambili zokuthengisela ukuthengisa - ukuphindaphinda kunye ne-wave soldering.
I-Wave soldering ibandakanya ukudlula kwi-solder kunye nebhodi eshushu ngaphambili.Ubushushu bebhodi, ukufudumeza kunye neeprofayili zokupholisa (ezingezona-linear), ukushisa kwe-soldering, i-waveform (iyunifomu), ixesha le-solder, izinga lokuhamba, isantya sebhodi, njl. zizinto zonke ezibalulekileyo ezichaphazela iziphumo ze-soldering.Yonke imiba yoyilo lwebhodi, uyilo, imilo yephedi kunye nobukhulu, ukutshatyalaliswa kobushushu, njl.
Kucacile ukuba i-wave soldering yinkqubo enobundlongondlongo nenyanzelisayo – kutheni ke usebenzisa obu buchule kwaphela?
Isetyenziswa kuba iyeyona ndlela ilungileyo nefikelelekayo, kwaye kwezinye iimeko yeyona ndlela isebenzayo.Apho kusetyenziswa izixhobo zokuphuma komngxuma, i-wave soldering idla ngokuba yeyona ndlela ikhethwayo.
I-Reflow soldering ibhekisela ekusebenziseni i-solder paste (umxube we-solder kunye ne-flux) ukudibanisa i-electronic components enye okanye ngaphezulu kwiipads zoqhagamshelwano, kunye nokunyibilikisa i-solder ngokufudumeza okulawulwayo ukufezekisa ukuxhamla ngokusisigxina.Ii-ovens zokufudumeza zingasetyenziswa , izibane zokufudumala kwe-infrared okanye imipu yokushisa kunye nezinye iindlela zokufudumeza zokufudumeza.I-Reflow soldering ineemfuno ezincinci kwi-pad shape, i-shading, ibhodi yokuqhelaniswa nebhodi, iprofayili yobushushu (isabaluleke kakhulu), njl. inkqubo ezenzekelayo, kunye namacandelo abekwe kwindawo kwaye ngokuqhelekileyo abanjwe yi-solder paste.I-Adhesives ingasetyenziselwa kwiimeko ezifunwayo, kodwa ayifanelekanga kunye neendawo ezihamba nge-hole - ngokuqhelekileyo i-reflow ayiyona indlela yokukhetha kwiindawo zokungena kumngxuma.Iibhodi ezidityanisiweyo okanye ezinoxinano oluphezulu zinokusebenzisa umxube we-reflow kunye ne-wave soldering, kunye neendawo ezikhokelayo ezibekwe kwelinye icala le-PCB (ebizwa ngokuba yi-A), ngoko ke zinokuthengiswa ngamaza kwicala B. Apho inxalenye ye-TH ifakwe phambi kokuba kufakwe inxalenye yomngxuma, icandelo linokuphinda lihanjiswe kwicala elingu-A.Iinxalenye ezongezelelweyo ze-SMD zinokongezwa kwicala le-B ukuze zithengiswe ngamaza e-TH.Abo bazimiseleyo kwi-soldering yocingo oluphezulu banokuzama imixube entsonkothileyo yee-solders ezahlukeneyo zokunyibilika, evumela ukuba icala le-B liphinde liphume phambi okanye emva kokutywinwa kwamaza, kodwa oku kunqabile kakhulu.
Itekhnoloji ye-reflow soldering isetyenziselwa iindawo zokunyuka komhlaba.Ngelixa uninzi lweebhodi zeesekethe zokunyuswa komhlaba zinokudityaniswa ngesandla kusetyenziswa intsimbi yokuthambisa kunye nocingo lwe-solder, inkqubo iyacotha kwaye ibhodi esiphumo inokungathembeki.Izixhobo zendibano zanamhlanje zePCB zisebenzisa i-reflow soldering ngokukodwa kwimveliso yobuninzi, apho oomatshini bokuthatha kunye nendawo babeka amacandelo kwiibhodi, eziqatywe nge-solder paste, kwaye yonke inkqubo izenzekelayo.
Ixesha lokuposa: Jun-05-2023