Eqhelekileyo Sn96.5Ag3.0Cu0.5 ingxubevange yemveli ekhokelayo-free reflow soldering ijiko lobushushu.A yindawo yokufudumeza, B yindawo yobushushu obungaguqukiyo (indawo yokumanzisa), kwaye uC yindawo yokunyibilika kwetin.Emva kwe-260S yindawo yokupholisa.
Sn96.5Ag3.0Cu0.5 ingxubevange yemveli engenalothe yokuphinda ijike ijiko lobushushu
Injongo yokufudumeza indawo A kukutshisa ngokukhawuleza ibhodi ye-PCB kwiqondo lokushisa lokusebenzisa i-flux.Iqondo lobushushu linyuka ukusuka kwiqondo lokushisa ukuya kwi-150 ° C malunga nemizuzwana engama-45-60, kwaye ithambeka kufuneka libe phakathi kwe-1 kunye ne-3. Ukuba iqondo lobushushu linyuka ngokukhawuleza, lisenokudilika kwaye likhokelela kwiziphene ezifana ne-solder bead kunye ne-bridging.
Ubushushu obuthe gqolo bezowuni B, ubushushu bunyuka kancinci ukusuka kwi-150°C ukuya kwi-190°C.Ixesha lisekelwe kwiimfuno ezithile zemveliso kwaye lilawulwa malunga ne-60 ukuya kwi-120 imizuzwana ukunika umdlalo opheleleyo kumsebenzi we-solvent flux kunye nokususa i-oxides kwi-welding surface.Ukuba ixesha lide kakhulu, ukusebenza ngokugqithisileyo kunokwenzeka, kuchaphazela umgangatho we-welding.Ngeli nqanaba, i-agent esebenzayo kwi-solvent flux iqala ukusebenza, kwaye i-rosin resin iqala ukuthambisa kunye nokuhamba.I-agent esebenzayo iyasasazeka kwaye ingena kunye ne-rosin resin kwi-PCB pad kunye ne-soldering end surface yengxenye, kwaye isebenzisana ne-oxide yomhlaba we-pad kunye nenxalenye ye-solder surface.Ukusabela, ukucoca umphezulu ukuba udityaniswe kunye nokususa ukungcola.Ngelo xesha, i-rosin resin ikhula ngokukhawuleza ukuze yenze ifilimu ekhuselayo kumgca wangaphandle we-welding surface kwaye ihlukanise ukudibanisa negesi yangaphandle, ukukhusela i-welding surface kwi-oxidation.Injongo yokumisela ixesha elaneleyo lobushushu kukuvumela iphedi ye-PCB kunye namacandelo ukuba afikelele kwiqondo lobushushu elifanayo ngaphambi kokuphinda kufakwe i-soldering kunye nokunciphisa umahluko weqondo lokushisa, kuba amandla okufunxa ubushushu amacandelo ahlukeneyo afakwe kwi-PCB ahluke kakhulu.Ukuthintela iingxaki ezisemgangathweni ezibangelwa ukungalingani kweqondo lokushisa ngexesha lokuhamba kwakhona, njengamatye amangcwaba, i-soldering yobuxoki, njl. Ukuba indawo yokushisa eqhubekayo ishushu ngokukhawuleza, i-flux kwi-solder paste iya kwandisa ngokukhawuleza kwaye iguqe, ibangele iingxaki ezahlukeneyo zekhwalithi ezifana ne-pores, ukuvuthela. itoti, namaso enkcenkce.Ukuba ixesha lobushushu eliqhubekayo lide kakhulu, i-solvent ye-flux iya kunyuka ngokugqithisileyo kwaye ilahlekelwe ngumsebenzi wayo kunye nomsebenzi wokukhusela ngexesha lokuthengiswa kwe-reflow, okukhokelela kuthotho lweziphumo ezibi ezifana ne-soldering ebonakalayo, iintsalela ezidibeneyo ze-solder ezimnyama, kunye ne-solder joints.Kwimveliso yokwenyani, ixesha lobushushu elingaguqukiyo kufuneka libekwe ngokweempawu zemveliso yokwenene kunye ne-lead-free solder paste.
Ixesha elifanelekileyo le-soldering zone C yi-30 ukuya kwi-60 imizuzwana.Lifutshane kakhulu ixesha lokunyibilika kwe-tin linokubangela iziphene ezifana ne-solder ebuthathaka, ngelixa ixesha elide linokubangela ukugqithisa kwe-dielectric metal okanye kube mnyama amalungu e-solder.Ngeli nqanaba, i-alloy powder kwi-solder paste iyanyibilika kwaye iphendule ngesinyithi kwindawo ethengisiweyo.I-solvent ye-flux iyabila ngeli xesha kwaye ikhawulezisa ukuguquguquka kunye nokungena, kwaye yoyise ukuxinezeleka komhlaba kumaqondo aphezulu obushushu, ivumela i-solder ye-alloy ye-alloy ukuba ihambe kunye ne-flux, isasazeke kumphezulu we-pad kwaye isonge indawo yesiphelo se-solder yenxalenye ukuba yenze. isiphumo sokumanzisa.Ngokwethiyori, okukhona iqondo lobushushu liphezulu, kokukhona isiphumo sokumanzisa ngcono.Nangona kunjalo, kwizicelo ezisebenzayo, ukunyamezela ubushushu obuphezulu bebhodi yePCB kunye namalungu kufuneka kuthathelwe ingqalelo.Ukulungelelaniswa kweqondo lokushisa kunye nexesha lendawo yokuphinda ithengiselwe i-reflow kukufuna ibhalansi phakathi kweqondo eliphezulu lobushushu kunye nesiphumo se-soldering, oko kukuthi, ukuphumeza umgangatho ofanelekileyo we-solder ngaphakathi kweqondo lobushushu elamkelekileyo kunye nexesha.
Emva kwendawo ye-welding yindawo yokupholisa.Kweli nqanaba, i-solder iyaphola ukusuka kulwelo ukuya kwi-solder ukwenza i-solder joints, kwaye iinkozo zekristale zenziwe ngaphakathi kwamalungu e-solder.Ukupholisa ngokukhawuleza kunokuvelisa i-solder ethembekileyo kunye ne-gloss ekhanyayo.Oku kungenxa yokuba ukupholisa ngokukhawuleza kunokwenza i-solder joint form i-alloy enesakhiwo esiqinileyo, ngelixa isantya sokupholisa esicothayo siya kuvelisa isixa esikhulu se-intermetal kwaye senze iinkozo ezinkulu kumphezulu odibeneyo.Ukuthembeka kwamandla omatshini aloo mxube we-solder uphantsi, kwaye Umphezulu we-solder joint uya kuba mnyama kwaye uphantsi kwi-gloss.
Ukumisela iqondo lobushushu le-lead-free reflow soldering
Kwinkqubo ye-lead-free reflow soldering process, i-oven cavity kufuneka iqhutywe kwiqhekeza lonke lesinyithi.Ukuba isithando somlilo senziwe ngamaqhekeza amancinci esinyithi, i-warping ye-cavity yesithando iya kwenzeka ngokulula phantsi kwamaqondo obushushu aphezulu angenalo lead.Kuyimfuneko kakhulu ukuvavanya ukuhambelana komkhondo kumaqondo obushushu aphantsi.Ukuba umzila ukhubazekile kumaqondo aphezulu okushisa ngenxa yezixhobo kunye noyilo, i-jamming kunye nokuwa kwebhodi kuya kuba yinto engenakuphepheka.Ngaphambili, i-Sn63Pb37 ehamba phambili yayiyi-solder eqhelekileyo.I-crystalline alloys zinendawo yokunyibilika efanayo kunye neqondo lomkhenkce, zombini yi-183°C.I-lead-free solder joint of SnAgCu ayikho i-eutectic alloy.Indawo yayo yokunyibilika yi-217°C-221°C.Ubushushu buqinile xa ubushushu bungaphantsi kwe 217°C, kwaye iqondo lobushushu limanzi xa ubushushu bungaphezu kwama 221°C.Xa iqondo lokushisa liphakathi kwe-217 ° C kunye ne-221 ° C I-alloy ibonisa isimo esingazinzanga.
Ixesha lokuposa: Nov-27-2023