Ii-oveni zokuphinda zisetyenziswe zisetyenziswa kwi-Surface Mount Technology (SMT) ukwenziwa okanye iinkqubo zokupakisha ze-semiconductor.Ngokuqhelekileyo, ii-ovens zokubuyisela kwakhona ziyinxalenye yomgca wokuhlanganisa i-electronics, kubandakanywa ukushicilela kunye noomatshini bokubeka.Umatshini wokushicilela uprinta i-solder paste kwi-PCB, kwaye umatshini wokubeka ubeka amacandelo kwi-solder eprintiweyo.
Ukumisela imbiza ye-Reflow Solder
Ukumisela i-oven yokubuyisela kwakhona kufuna ulwazi lwe-solder paste esetyenziswe kwindibano.Ngaba udaka lufuna indawo enenitrogen (ioksijini ephantsi) ngexesha lokufudumeza?Iinkcukacha zokuqukunjelwa kwakhona, kubandakanywa ubushushu obuphezulu, ixesha elingaphezu kolwelo (TAL), njl.?Nje ukuba ezi mpawu zenkqubo zaziwa, injineli yenkqubo inokusebenza ukuseta iresiphi ye-oven reflow ngenjongo yokufezekisa iprofayili ethile yokuphinda ibuyele.Iresiphi yeresiphi ye-oveni yokuqukumbela ibhekisa kwimimiselo yobushushu be-oveni, kubandakanywa amaqondo obushushu bezowuni, amazinga okuhambisa, kunye namazinga okuhamba kwegesi.Iprofayili yokubuyisela kwakhona iqondo lokushisa ibhodi "elibonayo" ngexesha lenkqubo yokubuyisela kwakhona.Kukho izinto ezininzi ekufuneka ziqwalaselwe xa uphuhlisa inkqubo yokubuyisela kwakhona.Ingakanani ibhodi yesekethe?Ngaba kukho nawaphi na amacandelo amancinci kakhulu ebhodini anokonakaliswa yi-convection ephezulu?Ngowuphi owona mlinganiselo uphezulu womlinganiselo weqondo lobushushu?Ngaba kukho ingxaki ngamazinga obushushu okukhula ngokukhawuleza?Yintoni imilo yeprofayile efunekayo?
Iimpawu kunye neeMpawu ze-Oven yokuPhuhlisa
Ii-ovens ezininzi zokubuyisela kwakhona zine-software yokuseta iresiphi ezenzekelayo evumela i-solder ye-reflow ukuba yenze iresiphi yokuqalisa ngokusekelwe kwiimpawu zebhodi kunye neenkcukacha ze-solder paste.Hlalutya i-reflow soldering ngokusebenzisa irekhoda ye-thermal okanye i-trailing thermocouple ucingo.I-Reflow setpoints inokulungelelaniswa phezulu / ezantsi ngokusekelwe kwiprofayili yokwenyani ye-thermal vs. iinkcukacha ze-solder paste kunye nezithintelo zebhodi / icandelo lobushushu.Ngaphandle kokuseta iresiphi ezenzekelayo, iinjineli zinokusebenzisa iprofayile yokubuyisela kwakhona kwaye ilungelelanise iresiphi ukugxila kwinkqubo ngokuhlalutya.
Ixesha lokuposa: Apr-17-2023