JUKI KE-2070High-speed bhetyebhetye chip shooter

Iimbonakalo:

(1) * Beka intloko-emilomo emininzi yentloko yelaser (imilomo emi-6)

(2) * Ireyithi yokubeka (max) -18,300 cph laser centering (IPC 9850) -4,600 cph vision centering kunye ne-MNVC (optical)

(3) * Uluhlu lwecandelo-01005 - 33.5 x 33.5mm

(4) * Ubude becandelo (ubuninzi) -12mm

(5) * Ukuchaneka kokubekwa-± 50μm (Cpk ≥ 1) i-laser centering

(6) * Ubungakanani bebhodi (ubukhulu) -800 x 460 mm(nokhetho olude)

Ukudibana kwi-Intanethi Qhagamshelana nathi

Iinkcukacha zeMveliso

Iithegi zeMveliso

1 Inzwa entsha yelaser: LNC60

Intloko entsha ye-laser ye-LNC60 iyakwazi ukukhetha kunye nokubeka embindini amacandelo ama-6 ngaxeshanye.Inokufikelela kwisantya ukuya kwi-18,300 CPH (IPC-9850), ukuphuculwa kwe-23% kwisizukulwana sangaphambili.Iintlobo zemibhobho eyahlukeneyo inokudityaniswa ngexesha elinye, ukunciphisa ixesha lokutshintsha umbhobho.Nge-MNVC ekhethiweyo (i-multi-nozzle vision centering), i-throughput yezixhobo ezichanekileyo ezichanekileyo zonyuka ngokuphawulekayo kwi-40%.Kwaye zonke ezi mpawu zifumaneka kumatshini odibeneyo ngokuphawulekayo kwimveliso engenakulinganiswa.

I-LNC60 izisa ingcamango entsha kwi-laser centering kwimarike.Esi sixhobo soluvo sinobuchule obukhethekileyo bokuseka amacandelo ukusuka kwi-0402 (01005) ukuya kwi-33.5mm iindawo zesikwere.Ukusuka kwi-ultra-small, i-ultra-thin, i-chip-shaped parts ukuya kwi-QFP encinci, i-CSP, i-BGA, uluhlu olubanzi lwamacandelo lunokunyuswa yinkqubo yokuqaphela i-laser kwi-speed-speed and high-accuracy.

2 Inkqubo ye-Dual XY yokuqhuba kunye neentloko eziqhutywa ngokuzimeleyo

Isakhelo esiphezulu esiqinileyo esenziwe ngokubumba isinyithi esityhidiweyo sidibanisa isakhelo se-Y axis.Ineempawu ezibalaseleyo zokuchasana nokungcangcazela ezixhasa ukusebenza ngesantya esiphezulu

Inkqubo yokuqhuba i-XY iquka i-JUKI yoqobo "Ulawulo oluvaliweyo olupheleleyo lwe-loop" isebenzisa ii-motor ze-AC kunye ne-encoder magnetic linear.Ukuqhutywa kweemoto ezimbini zombini i-X kunye no-Y ifezekisa isantya esiphezulu, kunye nokubekwa okuthembekileyo okungachatshazelwa luthuli kunye nokwahluka kobushushu.I-Z ezimeleyo kunye no-u motors iphucula ukuchaneka kunye nokomelela

3 Itekhnoloji yokubeka iziko lombono

Indlela yokubeka iziko inokukhethwa ngokusekelwe kuhlobo lwecandelo, imilo, ubungakanani kunye nezinto eziphathekayo.I-Laser centering isetyenziselwa ukubeka isantya esiphezulu samacandelo amancinci.Umbono usetyenziswa xa ukhokelo okanye ukuhlolwa kwebhola kufuneka okanye xa icandelo likhulu kakhulu kwilaser.Imilomo emininzi iyafumaneka kumalungu amile okwemnqakathi abonelela ngokuphathwa kwecandelo elingenakuthelekiswa nanto.

(2) MNVC (Multi-Nozzle Vision Centreing)

Umbono ogxininise ngentloko ye-nozzle eninzi iphantse iphinde kabini ireyithi yokubeka kumacandelo amancinci, aquka ii-CSP, ii-BGA, kunye nee-QFP ezincinci.(Ukhetho) I-MNVC iyafumaneka kwi-KE-2070.

4 Iimpawu eziphucukileyo zosetyenziso olusanda ngokwandayo kunye nolwahlukeneyo

(1) FCS (Flex Calibration System

Ukugcinwa lula kweJUKI kube lula ngakumbi!Ijigi yokulinganisa i-FCS ekhethiweyo kulula ukuyisebenzisa inkqubo ukulinganisa kwakhona ukuchaneka kokubekwa.Umatshini ukhetha ngokuzenzekelayo kwaye ubeke amacandelo e-jig, emva koko ulinganise impazamo kwaye ulungelelanise yonke imilinganiselo efunekayo.(ukhetho)

(2) Ukuqondwa okufihlakeleyo

Inkqubo yokukhanyisa ye-OCC ixhasa iindidi ezininzi zezixhobo zebhodi ezibandakanya i-FPC (ibhodi yeSekethe eShicileleyo eFlexible) Ukukhanya okucwangcisiweyo kunye nokukhanya okubhekiselele kuphucula ukuqondwa kwe-fiducial.