1.Ukufakwa kwentsebenzo ye-20000 CPH (elingana ne-0.18 imizuzwana / i-CHIP)
2. Inokuhambelana ne-0402-45 × 100mm element
3. Ngokuhambelana ne-substrate enkulu, ubukhulu be-L L510 × W460mm
4.Iintlobo ezininzi zezinto zokupakisha zediski, ezihambelana nohlobo lotshintshiselwano oluzenzekelayo
5.Isixhobo sokutyisa itreyi (ATS15)
6.Ibhanti eyakhelwe-ngaphakathi yokusika
I-7.32mm nangaphezulu ifuna ukufakelwa kwelungu elikhethekileyo lombhobho wokufunxa