Ukwenziwa kombane lolona hlobo lubalulekileyo lweshishini letekhnoloji yolwazi.Ukuveliswa kunye nokuhlanganiswa kweemveliso ze-elektroniki, i-PCBA (indibano yebhodi yesekethe eprintiweyo) yeyona nxalenye isisiseko kunye nebalulekileyo.Ngokuqhelekileyo kukho i-SMT (i-Surface Mount Technology) kunye ne-DIP (i-Dual in-line package) yemveliso.
Injongo yokulandela kwimveliso ye-electronic industry ikwandisa ubuninzi bokusebenza ngelixa inciphisa ubungakanani, oko kukuthi, ukwenza imveliso ibe yincinci kwaye ilula.Ngamanye amazwi, injongo kukongeza imisebenzi engaphezulu kwibhodi yesekethe yobungakanani obufanayo okanye ukugcina umsebenzi ofanayo kodwa ukunciphisa indawo ephezulu.Indlela yodwa yokufezekisa injongo kukunciphisa amacandelo e-elektroniki, ukuwasebenzisa ukubuyisela amacandelo aqhelekileyo.Ngenxa yoko, i-SMT iyaphuhliswa.
Itekhnoloji ye-SMT isekwe ekutshintshweni kwaloo malungu e-elektroniki aqhelekileyo ngohlobo lwe-wafer lwamacandelo e-elektroniki kunye nokusetyenziswa kwe-treyi ukupakisha.Kwangaxeshanye, indlela eqhelekileyo yokugrumba kunye nokufakwa ithathelwe indawo yintlama ekhawulezayo kumphezulu wePCB.Ngaphezu koko, indawo yomphezulu we-PCB incitshisiwe ngokuphuhlisa iileya ezininzi zeebhodi ukusuka kumaleko ebhodi enye.
Izixhobo eziphambili zomgca wemveliso we-SMT ziquka: Umshicileli we-Stencil, i-SPI, i-pick and place machine, i-reflow soldering oven, i-AOI.
Izinto ezilungileyo ezivela kwiimveliso ze-SMT
Ukusebenzisa i-SMT kwimveliso ayenzelwanga kuphela imfuno yemarike kodwa nefuthe layo elingathanga ngqo ekucutheni iindleko.I-SMT yehlisa iindleko ngenxa yoku kulandelayo:
1. Indawo efunekayo yomgangatho kunye neengqimba zePCB ziyancitshiswa.
Ummandla ofunekayo womphezulu we-PCB wokuthwala amacandelo uncitshisiwe ngenxa yokuba ubungakanani baloo macandelo okudibanisa bucuthiwe.Ngaphezu koko, iindleko ze-PCB ziyacuthwa, kwaye akusekho zindleko zokuqhuba ukomba kwimingxuma yokutyhutyha.Kungenxa yokuba i-soldering ye-PCB kwindlela ye-SMD ithe ngqo kwaye ithe tyaba endaweni yokuthembela kwizikhonkwane zamacandelo kwi-DIP ukuba idlule kwimingxuma egrunjiweyo ukuze ithengiswe kwi-PCB.Ukongeza, uyilo lwePCB lusebenza ngakumbi xa kungekho mingxunya, kwaye ngenxa yoko, iileya ezifunekayo zePCB ziyancitshiswa.Umzekelo, iileya ezine zantlandlolo zoyilo lwe-DIP zinokuncitshiswa zibe ngamanqanaba amabini ngendlela ye-SMD.Kungenxa yokuba xa usebenzisa indlela ye-SMD, iiplanga ezimbini zeebhodi ziya kukwanela ukufakwa kuzo zonke iintambo.Ixabiso leebhodi ezimbini zeebhodi ngokuqinisekileyo lingaphantsi kwelo leebhodi ezine zeebhodi.
2. I-SMD ifaneleke ngakumbi kwisixa esikhulu semveliso
Ukupakishwa kwe-SMD kwenza kube lukhetho olungcono kwimveliso ezenzekelayo.Nangona kulawo macandelo e-DIP aqhelekileyo, kukho kwakhona indawo yokudibanisa ngokuzenzekelayo, umzekelo, uhlobo oluthe tye lomatshini wokufaka, uhlobo oluthe nkqo lomatshini wokufaka, umatshini wokufaka ongaqhelekanga, kunye nomatshini wokufaka i-IC;nangona kunjalo, imveliso ngexesha ngalinye iyunithi isengaphantsi kwe-SMD.Njengoko isixa semveliso sinyuka ngalo lonke ixesha lokusebenza, iyunithi yeendleko zemveliso iyancipha.
3. Kufuneka abasebenzi abambalwa
Ngokuqhelekileyo, kuphela malunga nabaqhubi abathathu abafunekayo ngomgca wemveliso we-SMT, kodwa ubuncinane abantu abali-10 ukuya kuma-20 bayafuneka ngomgca we-DIP.Ngokunciphisa inani labantu, akuncitshiswa kuphela iindleko zabasebenzi kodwa nolawulo luba lula.
Ixesha lokuposa: Apr-07-2022