Indawo yeqondo lobushushu le-Chengyuan yohlulwe ikakhulu ngokwemimandla emine yobushushu: indawo yokufudumeza, indawo yobushushu obungaguqukiyo, indawo yokuthambisa, kunye nendawo yokupholisa.
1. Indawo yokufudumala
Ukufudumala yinqanaba lokuqala lenkqubo yokuphinda i-solder.Ngethuba le nqanaba lokubuyela kwakhona, yonke indibano yebhodi yesekethe iqhubeleka ngokuqhubekayo ngokubhekiselele kwiqondo lokushisa ekujoliswe kulo.Injongo ephambili yesigaba se-preheat kukuzisa yonke ibhodi yebhodi ngokukhuselekileyo kwi-pre-reflow temperature.Ukufudumala kwakhona kunethuba lokukhupha i-solvents eguqukayo kwi-solder paste.Ukuze i-solvent ye-pasty ikhuphe ngokufanelekileyo kwaye indibano ifikelele ngokukhuselekileyo kumaqondo obushushu angaphambili, i-PCB kufuneka ifudunyezwe ngendlela ehambelanayo, ehambelanayo.Isalathisi esibalulekileyo senqanaba lokuqala lenkqubo yokubuyisela kwakhona yi-slope yeqondo lokushisa okanye ixesha lokuhamba kweqondo lokushisa.Oku kudla ngokulinganiswa ngeedigri zeCelsius ngesekhondi C/s.Izinto ezininzi eziguquguqukayo zinokuchaphazela eli nani, kubandakanywa: ixesha lokucubungula ekujoliswe kulo, ukuguquguquka kwe-solder paste, kunye nokuqwalaselwa kwecandelo.Kubalulekile ukuqwalasela zonke ezi ziguquguqukayo zenkqubo, kodwa kwiimeko ezininzi ukuqwalaselwa kwamacandelo abuthathaka kubaluleke kakhulu.“Amalungu amaninzi aya kuqhekeka ukuba iqondo lobushushu litshintsha ngokukhawuleza kakhulu.Elona qondo liphezulu lokutshintsha kwe-thermal anokumelana nawona malungu anobuzaza iba ngowona mthambeka uphezulu uvumelekileyo.Nangona kunjalo, i-slope inokulungiswa ukuphucula ixesha lokucubungula ukuba izinto ezibuthathaka ze-thermal azisetyenziswanga kunye nokwandisa ukuphuma.Ngoko ke, abavelisi abaninzi banyusa la mathambeka ukuya kumlinganiselo ovumelekileyo jikelele jikelele we-3.0 ° C/sec.Ngakolunye uhlangothi, ukuba usebenzisa i-solder paste equlethe i-solvent eyomeleleyo, ukufudumeza icandelo ngokukhawuleza kunokudala inkqubo yokubaleka.Njengezinyibilikisi eziguquguqukayo ziphuma ngaphandle, zinokutshiza i-solder ukusuka kwiipadi kunye neebhodi.Iibhola ze-Solder ziyingxaki enkulu yokukhupha ubundlobongela ngexesha lesigaba sokufudumala.Emva kokuba ibhodi iphakanyiswe kwiqondo lokushisa ngexesha lesigaba se-preheat, kufuneka ingene kwisigaba sokushisa esiqhubekayo okanye isigaba sangaphambili.
2. Ummandla wobushushu rhoqo
I-reflow ye-reflow yeqondo lokushisa rhoqo ngokuqhelekileyo i-60 ukuya kwi-120 ye-exposure ye-second yokukhupha i-solder paste volatiles kunye nokusebenza kwe-flux, apho iqela le-flux liqala i-redox kwi-redox yecandelo kunye neepads.Ukushisa okugqithisileyo kunokubangela ukutshiza okanye ukubhola kwe-solder kunye ne-oxidation ye-solder paste eqhotyoshelweyo kunye neeterminals zecandelo.Kwakhona, ukuba ubushushu buphantsi kakhulu, i-flux ayinakusebenza ngokupheleleyo.
3. Indawo ye-welding
Amaqondo obushushu aqhelekileyo ngama-20-40°C ngaphezu kolwelo.[1] Lo mda unqunywe yinxalenye ephantsi kokumelana nokushisa okuphezulu (inxalenye echaphazelekayo kumonakalo wokushisa) kwindibano.Isikhokelo esisemgangathweni kukukhupha i-5 ° C ukusuka kubushushu obukhulu elona candelo lithambileyo linokumelana nokufika kubushushu benkqubo ephezulu.Kubalulekile ukubeka iliso kwinkqubo yokushisa ukukhusela ukudlula lo mda.Ukongezelela, ukushisa okuphezulu (ngaphezu kwe-260 ° C) kunokonakalisa ii-chips zangaphakathi zamacandelo e-SMT kunye nokukhuthaza ukukhula kwe-intermetallic compounds.Kwelinye icala, iqondo lobushushu elingatshisi ngokwaneleyo linokuthintela udaka ukuba lungaphindeli kwakhona ngokwaneleyo.
4. Indawo yokupholisa
Indawo yokugqibela yindawo yokupholisa ngokuthe ngcembe ukupholisa ibhodi esetyenzisiweyo kunye nokuqinisa amalunga e-solder.Ukupholisa okufanelekileyo kucinezela ukwakheka kwekhompawundi ye-intermetallic engafunwayo okanye ukothuka kwe-thermal kumalungu.Amaqondo obushushu aqhelekileyo kwindawo yokupholisa aqala kwi-30-100°C.Izinga lokupholisa lika-4°C/s liyacetyiswa ngokubanzi.Le yiparameter ekufuneka iqwalaselwe xa uhlalutya iziphumo zenkqubo.
Ukuze ufumane ulwazi oluthe kratya lwetekhnoloji ye-reflow soldering, nceda ujonge amanye amanqaku e-Chengyuan Industrial Automation Equipment
Ixesha lokuposa: Jun-09-2023