Izinto ezininzi ze-elektroniki azikaxhonywa phezulu kusetyenziswa i-SMD.Ngesi sizathu, i-SMT kufuneka ivumele iikhomponenti zomngxunya.Izixhobo zokubeka umphezulu, ezisebenzayo kunye ne-passive, xa zifakwe kwi-substrate, zenza iintlobo ezintathu eziphambili zeendibano ze-SMT - ngokuqhelekileyo zibizwa ngokuba yi-Type I, i-Type II kunye ne-Type III.Iindidi ezahlukeneyo zicutshungulwa ngendlela eyahlukileyo, kwaye zontathu iindidi zifuna izixhobo ezahlukeneyo.
1. Iindibano ze-III ze-SMT ziqulethe kuphela amacandelo e-discrete surface Mount (i-resistors, i-capacitors kunye nee-transistors) ezincanyathiselwe kwicala elingezantsi.
2.Izixhobo zoHlobo lwe-I ziqulathe amacandelo okunyuka komphezulu kuphela.Amacandelo anokuba calanye okanye aphindwe kabini.
3. Amalungu odidi lwe-II ludibaniso loHlobo lwe-III kunye noHlobo lwe-I. Ngokuqhelekileyo aluqulathanga naziphi na izixhobo zokunyusela umphezulu osebenzayo kwicala elingezantsi, kodwa inokuqulatha izixhobo zokunyusela umphezulu ocacileyo kwicala elingezantsi.
Ukuba i-pitch inkulu kwaye ilungile, ubunzima bendibano ye-SMT kwisixhobo sombane buya kwanda.
I-Ultra-fine pitch, i-QFP (i-Quad Flat Pack), i-TCP (i-Tape Carrier Package) okanye i-BGA (i-Ball Grid Array) kunye nezixhobo ezincinci ze-chip (0603 okanye i-0402 okanye ezincinci) zisetyenziselwa ezi zixhobo kunye nezemveli (i-50 mil pitch )) iphakheji yokunyusa umgangatho.
Iinkqubo zazo zontathu iindawo zokunyuswa komphezulu zibandakanya - izinto zokuncamathelisa, i-solder paste, ukubeka, i-soldering kunye nokucoca okulandelwa kukuhlolwa, ukuvavanywa kunye nokulungiswa.
I-Chengyuan Industrial Automation, umenzi wezixhobo ze-SMT oyingcali.
Ixesha lokuposa: Mar-29-2023