Kwixesha langoku lophuhliso olwandayo lweemveliso ze-elektroniki, ukuze kulandelwe ubungakanani obuncinci obunokwenzeka kunye nendibano enzulu yeeplagi, iiPCB ezinamacala amabini ziye zaziwa kakhulu, kwaye ngakumbi nangakumbi, abayili ukuze bayile amancinci, ngakumbi. compact kunye nexabiso eliphantsi iimveliso.Kwinkqubo ye-lead-free reflow soldering, i-double-side-side-reflow soldering isetyenziswe ngokuthe ngcembe.
Uhlalutyo lwenkqubo yokuphinda iveliswe ngokuphindwe kabini emacaleni okukhokelayo:
Ngapha koko, uninzi lweebhodi zePCB ezinamacala aphindwe kabini zisathengisa icala lecandelo ngokujikeleza kwakhona, kwaye emva koko zithengise icala lesikhonkwane ngokuthengiswa kwamaza.Imeko enjalo yi-soldering ye-reflow yangoku ephindwe kabini, kwaye kusekho iingxaki kwinkqubo engakhange isonjululwe.Icandelo elisezantsi lebhodi enkulu kulula ukuwa ngexesha lenkqubo ye-reflow yesibini, okanye inxalenye ye-solder ephantsi iyanyibilika ukuze kubangele iingxaki zokuthembeka kwe-solder joint.
Ke, kufuneka sifezekise njani i-solder ephindwe kabini?Eyokuqala kukusebenzisa iglu ukuze unamathele amacandelo kuyo.Xa iguqulwe kwaye ingena kwi-soldering ye-reflow yesibini, amacandelo aya kulungiswa kuwo kwaye akayi kuwa.Le ndlela ilula kwaye iyasebenza, kodwa idinga izixhobo ezongezelelweyo kunye nokusebenza.Amanyathelo ukugqiba, ngokwendalo kwandisa iindleko.Okwesibini kukusebenzisa i-alloys ye-solder eneendawo ezahlukeneyo zokunyibilika.Sebenzisa i-alloy ephezulu yokunyibilika kwicala lokuqala kunye ne-alloy esezantsi yokunyibilika kwicala lesibini.Ingxaki ngale ndlela kukuba ukhetho lwe-alloy ye-melting point ephantsi inokuchaphazeleka yimveliso yokugqibela.Ngenxa yokunciphisa ubushushu bokusebenza, ii-alloys ezinendawo ephezulu yokunyibilika ziya kwandisa iqondo lobushushu le-reflow soldering, nto leyo eya kubangela umonakalo kumacandelo kunye nePCB ngokwayo.
Kuninzi lwamacandelo, ukunyanzeliswa komphezulu we-tin etyhidiweyo kwi-joint kwanele ukubamba indawo engezantsi kwaye wenze i-solder ethembekileyo edibeneyo.Umgangatho we-30g / in2 udla ngokusetyenziswa ekuyilweni.Indlela yesithathu kukuvuthela umoya obandayo kwindawo engezantsi yesithando somlilo, ukwenzela ukuba ubushushu bendawo ye-solder emazantsi e-PCB bukwazi ukugcinwa ngaphantsi kwendawo yokunyibilika kwi-soldering ye-reflow yesibini.Ngenxa yokuhluka kweqondo lokushisa phakathi kweendawo eziphezulu kunye nezantsi, uxinzelelo lwangaphakathi luyenziwa, kwaye iindlela ezifanelekileyo kunye neenkqubo zifunekayo ukuphelisa uxinzelelo kunye nokuphucula ukuthembeka.
Ixesha lokuposa: Jul-13-2023