Kwihlabathi lanamhlanje elikhawulezayo lokwenziwa kwezinto zombane, ukuchaneka nokusebenza kakuhle ziimpawu zempumelelo.Njengoko itekhnoloji iqhubeka nokuhambela phambili, amashishini kufuneka axhotyiswe ngezixhobo zamva nje zokuhlala phambi kwegophe.Umatshini we-oven reflow sisixhobo esitshintsha ngokupheleleyo inkqubo yokuvelisa.Kule bhlog, siza kuphonononga iimpawu kunye nezibonelelo zomatshini we-oveni owenziwe ngokutsha kunye nokuba ungawuphucula njani umsebenzi wakho wokuvelisa ukuhambisa iimveliso ezikumgangatho ophezulu.
1. Qonda umatshini we-reflow soldering.
Oomatshini be-oven yokuqukumbela zizixhobo ezikhethekileyo ezisetyenziselwa indibano yeSurface Mount Technology (SMT).Isetyenziswa ikakhulu kwinkqubo yokuvelisa ibhodi yesekethe eprintiweyo (PCB).Eyona njongo yalo matshini kukuthengisa amacandelo e-elektroniki kwi-PCB ngokucokisa i-solder.Ngokunyibilika ngokuchanekileyo i-solder paste, amacandelo ahlanganiswe ngokuqinileyo phezulu, ukuqinisekisa ukudibanisa kombane kunye nokuzinza komatshini.
2. Izinto eziluncedo zokusebenzisa umatshini wokuphinda uvelise i-solder.
a) Ukuchaneka okuphuculweyo: Oomatshini be-oven abahlaziyiweyo banokulawula ngokuchanekileyo iprofayili yeqondo lokushisa ukuqinisekisa ukufudumeza okuhambelanayo kunye nokuchanekileyo.Olu lawulo oluchanekileyo luphelisa umngcipheko woxinzelelo lwe-thermal kumacandelo abucayi, ukukhusela umonakalo kunye nokwandisa ubomi bemveliso yokugqibela.
b) Ukonyuka kobuchule: Aba matshini baxhotyiswe ngenkqubo yokuhambisa ekwaziyo ukuphatha iiPCB ezininzi ngaxeshanye nangokunxuseneyo.Eli nqaku linciphisa kakhulu ixesha lokuvelisa, landa i-throughput, ukwandisa ukusebenza kakuhle kunye nokwandisa imveliso.
c) Ukuguquguquka: Oomatshini be-oveni yokuqubha kwakhona banokuphatha ngokuguquguqukayo ubungakanani obahlukeneyo bePCB kunye nobunzima.Ingaba uyakha iiprototypes ezincinci okanye ukuveliswa kwevolumu ephezulu, aba matshini banokuhlengahlengiswa kwiimfuno zakho ezithile, ukuhlalisa ubungakanani beebhodi ezahlukeneyo kunye noxinzelelo lwamacandelo.
d) Uqinisekiso loMgangatho: Ukufudumeza okulawulwayo kunye neeprofayili zokupholisa ziqinisekisa ukuthengiswa okufanayo kwi-PCB yonke, ukuphelisa umngcipheko we-solder bridging okanye i-joint joints.Oku kubangela umgangatho ophezulu, imveliso ethembekileyo eyandisa ukwaneliseka kwabathengi kunye nokunciphisa imfuno yokusebenza kwakhona.
3. Khetha umatshini wokuphinda uvelise i-solder efanelekileyo.
Xa ucinga ngokukhetha umatshini we-oven ophinda uqukunjelwe kumsebenzi wakho wokuvelisa, kukho izinto ezininzi ezifanele ukuhoywa.Ezi ziquka:
a) Itekhnoloji yokufudumeza: Qinisekisa ukuba i-convection okanye inkqubo yokufudumeza kwe-infrared ifanelekile kwiimfuno zakho ezithile.Itekhnoloji nganye ineengenelo zayo kwaye inokubonelela ngeeprofayili ezahlukeneyo zobushushu, ke khetha itekhnoloji ehlangabezana neemfuno zakho zokwenziwa.
b) Ulawulo lobushushu: Qinisekisa ukuba umatshini ubonelela ngolawulo oluchanekileyo lobushushu, njengoko luchaphazela ngokuthe ngqo umgangatho kunye nokuthembeka kwamalungu e-solder.Ukutshintsha kobushushu kufuneka kuncitshiswe kwaye kulawulwe kakuhle kuyo yonke inkqubo yokubuyisela kwakhona.
c) Isixokelelwano sokuhambisa: Vavanya isantya, i-throughput kunye nokulungelelaniswa kwenkqubo yokuhambisa ukujongana nobukhulu bephaneli ezahlukeneyo.Iinkqubo zokuhambisa ezomeleleyo nezithembekileyo zibalulekile kwimveliso engenamthungo.
Ukuququmbela:
Kwilizwe elikhuphisana kakhulu lokwenziwa kwezixhobo zombane, ii-oveni zokuphinda zivele ziphinde zibe yi-asethi ephambili yeenkqubo zokuthengisela ezichanekileyo nezichanekileyo.Inika ukuhambelana, ukuguquguquka kunye nemveliso ephezulu, inceda ukuvelisa iimveliso eziphezulu kunye nokunciphisa amaxesha okujikeleza.Ngokwenza utyalo-mali kobu buchwephesha buhambele phambili, iinkampani zinokuphucula imisebenzi yazo yokuvelisa, ukuhlangabezana neemfuno zabathengi kwaye zigqithise ulindelo lwemarike.Ii-oveni zokuqukumbela ngenene zimele isango lempumelelo kwihlabathi eliguqukayo lokwenziwa kombane.
Ixesha lokuposa: Nov-08-2023