(1) Umgaqo wei-reflow soldering
Ngenxa ye-miniaturization eqhubekayo yeebhodi zePCB zemveliso ye-elektroniki, amacandelo e-chip avele, kwaye iindlela zemveli ze-welding azikwazanga ukuhlangabezana neemfuno.I-reflow soldering isetyenziselwa ukuhlanganiswa kweebhodi zesekethe ezidibeneyo ezidibeneyo, kwaye uninzi lwamacandelo adibeneyo kunye ne-welded yi-chip capacitors, i-chip inductors, i-transistors ephakanyisiweyo kunye ne-diode.Ngophuhliso lwetekhnoloji ye-SMT epheleleyo ngakumbi nangakumbi, ukuvela kwezinto ezahlukeneyo ze-chip (SMC) kunye nezixhobo zokukhwela (i-SMD), inkqubo yokuthengisa itekhnoloji ye-reflow kunye nezixhobo njengenxalenye yetekhnoloji yokunyuka nayo iye yaphuhliswa ngokufanelekileyo. , yaye izicelo zabo ziya zisiba banzi.Isetyenziswe phantse kuwo onke amasimi emveliso yombane.I-Reflow soldering i-solder ethambileyo eqaphela uxhulumaniso lomatshini kunye nombane phakathi kweephelo ze-solder zamacandelo afakwe phezulu okanye izikhonkwane kunye neepads zebhodi eziprintiweyo ngokuxutywa kwe-paste-loaded solder esasazwa kwangaphambili kwiipads zebhodi eziprintiweyo.weld.I-Reflow soldering kumacandelo e-solder kwibhodi ye-PCB, kunye ne-reflow soldering kukunyusa izixhobo phezulu.I-Reflow soldering ixhomekeke kwisenzo sokuhamba komoya oshushu kumalungu e-solder, kwaye i-jelly-efana ne-jelly flux ifumana ukusabela komzimba phantsi kobushushu obuthile obuphezulu bokuhamba komoya ukufikelela kwi-sMD soldering;ngoko kuthiwa "i-reflow soldering" ngenxa yokuba igesi ijikeleza kumatshini we-welding ukuvelisa ukushisa okuphezulu ukufezekisa injongo ye-soldering..
(2) Umgaqo wei-reflow solderingUmatshini wohlulwe ngokweenkcazo ezininzi:
A. Xa i-PCB ingena kwindawo yokufudumeza, i-solvent kunye negesi kwi-solder paste iyajika.Ngelo xesha, i-flux kwi-solder paste imanzisa iipads, ii-terminals zecandelo kunye nezikhonkwane, kwaye i-solder paste iyathambisa, idibanise, kwaye igubungele i-solder paste.ipleyiti yokuhlukanisa iipads kunye nezikhonkwane zecandelo kwi-oxygen.
B. Xa i-PCB ingena kwindawo yokugcina ubushushu, i-PCB kunye nezixhobo zifudumeza ngokupheleleyo ukuthintela i-PCB ukuba ingene ngokukhawuleza kwindawo yokushisa ephezulu ye-welding kwaye yonakalise i-PCB kunye namalungu.
C. Xa PCB ingena kwindawo welding, iqondo lobushushu liyenyuka ngokukhawuleza ukuze intlama solder ifikelele kwimo etyhidiweyo, kwaye solder ulwelo wet, diffuses, diffuses, okanye reflows pads, icandelo iziphelo kunye nezikhonkwane PCB ukwenza amalungu solder. .
D. I-PCB ingena kwindawo yokupholisa ukuze iqinise i-solder joints;xa i-reflow soldering igqityiwe.
(3) Iimfuno zenkqubo yei-reflow solderingumatshini
Itekhnoloji ye-Reflow soldering ayiqhelekanga kwintsimi yokwenziwa kwe-elektroniki.Amalungu kwiibhodi ezahlukeneyo ezisetyenziswa kwiikhompyuter zethu athengiswa kwiibhodi zeesekethe ngale nkqubo.Iingenelo zale nkqubo kukuba ukushisa kulula ukulawula, i-oxidation inokuphetshwa ngexesha lenkqubo ye-soldering, kwaye iindleko zokuvelisa kulula ukulawula.Kukho isekethe yokufudumeza ngaphakathi kwesi sixhobo, esifudumeza igesi yenitrogen ukuya kubushushu obuphezulu ngokwaneleyo kwaye uyivuthele kwibhodi yesekethe apho amacandelo afakwe khona, ukuze i-solder kumacala omabini amacandelo anyibilike aze adityaniswe kwi-motherboard. .
1. Cwangcisa iprofayili yobushushu obufanelekileyo bokubuyisela kwakhona kwaye wenze uvavanyo lwexesha lokwenyani lweprofayili yobushushu rhoqo.
2. Weld ngokwendlela welding yoyilo PCB.
3. Ukuthintela ngokungqongqo ibhanti lokuhambisa ukuba lingcangcazele ngexesha lenkqubo ye-welding.
4. I-welding effect yebhodi eprintiweyo kufuneka ihlolwe.
5. Ingaba i-welding yanele, ingaba umphezulu we-solder joint egudileyo, ingaba ubume be-solder joint half-moon, imeko yeebhola ze-solder kunye neentsalela, imeko ye-welding eqhubekayo kunye ne-welding virtual.Kwakhona khangela PCB umphezulu utshintsho umbala kunye njalo.Kwaye ulungise ijika lobushushu ngokweziphumo zokuhlola.Umgangatho we-welding kufuneka uhlolwe rhoqo kulo lonke ixesha lokuvelisa.
(4) Izinto ezichaphazela inkqubo yokuhanjiswa kwakhona:
1. Ngokuqhelekileyo i-PLCC kunye ne-QFP zinomthamo omkhulu wokushisa kune-discrete chip components, kwaye kunzima kakhulu ukuwelda iindawo ezinkulu kunezincinci ezincinci.
2. Kwi-oven yokubuyisela kwakhona, ibhanti yokuhambisa iphinda ibe yinkqubo yokutshatyalaliswa kobushushu xa iimveliso ezihanjiswayo ziphinde zihanjiswe ngokuphindaphindiweyo.Ukongezelela, iimeko zokutshatyalaliswa kobushushu kumda kunye neziko lendawo yokufudumala zihluke, kwaye izinga lokushisa emphethweni liphantsi.Ukongeza kwiimfuno ezahlukeneyo, ukushisa kwendawo efanayo yokulayisha kwakhona kuyahluka.
3. Impembelelo yokulayishwa kwemveliso eyahlukeneyo.Ukulungelelaniswa kweprofayili yokushisa kwe-reflow soldering kufuneka kuthathelwe ingqalelo ukuba ukuphindaphinda okulungileyo kunokufumaneka phantsi komthwalo, umthwalo kunye nezinto ezahlukeneyo zomthwalo.Umthwalo womthwalo uchazwa ngolu hlobo: LF=L/(L+S);apho L=ubude besubstrate edityanisiweyo kunye no-S=isithuba se-substrate edibeneyo.Ukuphakama komthwalo womthwalo, kunzima ngakumbi ukufumana iziphumo eziphinda zenziwe kwakhona kwinkqubo yokubuyisela kwakhona.Ngokuqhelekileyo umthamo omkhulu womthwalo we-oven yokubuyisela kwakhona kuluhlu lwe-0.5 ~ 0.9.Oku kuxhomekeke kwimeko yemveliso (icandelo le-soldering density, i-substrates eyahlukeneyo) kunye neemodeli ezahlukeneyo zokufudumeza kwakhona.Amava asebenzayo abalulekile ukufumana iziphumo ezilungileyo ze-welding kunye nokuphindaphinda.
(5) Ziziphi iingenelo zei-reflow solderingiteknoloji koomatshini?
I-1) Xa i-soldering nge-reflow soldering iteknoloji, akukho mfuneko yokuntywilisela ibhodi yesiphaluka eprintiweyo kwi-solder etyhidiweyo, kodwa ukufudumeza kwendawo kusetyenziselwa ukugqiba umsebenzi we-solder;ngoko ke, iikhomponenti eziya kuthengiswa zixhomekeke kumothuko omncinci we-thermal kwaye aziyi kubangelwa ngumonakalo ogqithisayo kumacandelo.
2) Ekubeni iteknoloji ye-welding idinga kuphela ukusebenzisa i-solder kwi-welding part kwaye ishushu kwindawo ukuze igqibe i-welding, iziphene ze-welding ezifana ne-bridging ziyagwenywa.
I-3) Kwi-teknoloji ye-reflow soldering process, i-solder isetyenziswe kanye kuphela, kwaye akukho nto iphinda isetyenziswe, ngoko i-solder ihlambulukile kwaye ikhululekile kwizinto ezingcolileyo, eziqinisekisa umgangatho we-solder joints.
(6) Intshayelelo kwinkqubo yokuhamba kwei-reflow solderingumatshini
Inkqubo ye-reflow soldering yibhodi yokunyuka kwendawo, kwaye inkqubo yayo inzima ngakumbi, enokuthi ihlulwe ibe yintlobo ezimbini: ukunyuswa kwecala elilodwa kunye nokunyuka kwamacala amabini.
A, ukuxhoma kwicala elinye: intlama yesoda yangaphambili → isiziba (sahlulwe saziisixhobo sokuxhoma ngesandla kunye nomatshini wokuzixhoma) → ukuphinda kufakwe i-solder → ukuhlolwa kunye novavanyo lombane.
B, Ukunyuswa okumacala amabini: Ncama yesolder yangaphambili kwi-A ecaleni → SMT (yahlulahlulwe yaziindawo ezibekwa ngesandla kunye nokubekwa koomatshini okuzenzekelayo) → Ukuphinda kufakwe i-solder → Ncama yangaphambili yokugquma i-solder kwicala elingu-B → SMD (yahlulwe ngokubekwa ngesandla kunye nokubekwa komatshini ngokuzenzekelayo ) ukubekwa) → ukusoda kwakhona → uhlolo novavanyo lombane.
Inkqubo elula ye-reflow soldering yi "screen printing solder paste - patch - reflow soldering, eyona nto iphambili kukuchaneka kokuprintwa kwesikrini sesilika, kwaye izinga lesivuno lichongwa yiPPM yomatshini wokudibanisa i-patch soldering, kunye ne-reflow soldering. ukulawula ukunyuka kobushushu kunye nobushushu obuphezulu.kunye nokuhla kwegophe lobushushu.”
(7) Inkqubo yokugcinwa kwezixhobo zomatshini wokuthambisa kwakhona
Umsebenzi wokulungisa ekufuneka siwenze emva kokusetyenziswa kwe-reflow soldering;ngaphandle koko, kunzima ukugcina ubomi benkonzo yezixhobo.
1. Yonke inxalenye kufuneka ihlolwe imihla ngemihla, kwaye ingqwalasela ekhethekileyo kufuneka ihlawulwe kwibhanti lokuhambisa, ukuze lingakwazi ukunamathela okanye ukuwa.
2 Xa ulungisa umatshini, umbane kufuneka ucinywe ukuthintela ukutshitshiswa kombane okanye isiphaluka esifutshane.
3. Umatshini kufuneka uzinze kwaye ungathambeki okanye ungazinzi
4. Kwimeko yemimandla yobushushu obubodwa eyeka ukufudumeza, jonga kuqala ukuba ifuse ehambelanayo isasazwe kwangaphambili kwipadi yePCB ngokunyibilikisa intlama.
(8) Izilumkiso kumatshini wokuphinda uqukunjelwe
1. Ukuze kuqinisekiswe ukhuseleko lomntu, umqhubi kufuneka asuse iilebula kunye nemihlobiso, kwaye imikhono akufanele ikhululeke kakhulu.
2 Nika ingqalelo kubushushu obuphezulu ngexesha lokusebenza ukuthintela ukugcinwa kokutshisa
3. Musa ukuseta ngokungekho mthethweni indawo yobushushu kunye nesantya sei-reflow soldering
4. Qinisekisa ukuba igumbi lingena umoya, kwaye i-extractor yomsi kufuneka ikhokelele ngaphandle kwefestile.
Ixesha lokuposa: Sep-07-2022