Izizathu eziphambili zokufudumeza okungalinganiyo kwamacandelo kwinkqubo ye-SMT ekhokelayo-free reflow soldering yilezi: i-lead-free reflow soldering imveliso yomthwalo, ibhanti lokuhambisa okanye i-heater edge edge impembelelo, kunye nokwahlukana kumthamo wokushisa okanye ukufunxa ubushushu be-lead-free reflow soldering components.
①Impembelelo yemithamo eyahlukeneyo yokulayishwa kwemveliso.Ukulungelelaniswa kwejika lobushushu le-lead-free reflow soldering kufuneka kuthathelwe ingqalelo ukufumana ukuphindaphinda okulungileyo phantsi komthwalo, umthwalo kunye nezinto ezahlukeneyo zomthwalo.Umthwalo womthwalo uchazwa ngolu hlobo: LF=L/(L+S);apho L=ubude besubstrate edityanisiweyo kunye no-S=isithuba phakathi kwezixhobo ezingaphantsi ezidityanisiweyo.
②Kwi-oveni yokukhupha i-lead-free-free, ibhanti yokuhambisa iphinda ibe yinkqubo yokulahla ubushushu ngelixa iphinda ithutha iimveliso ze-lead-free reflow soldering.Ukongezelela, iimeko zokutshatyalaliswa kobushushu zihluke kumda kunye neziko lendawo yokufudumala, kwaye izinga lokushisa emphethweni liphantsi ngokubanzi.Ukongeza kwiimfuno ezahlukeneyo zeqondo lokushisa kwindawo nganye yokushisa kwisithando somlilo, iqondo lokushisa kwindawo yomthwalo ofanayo nalo lihlukile.
③ Ngokubanzi, i-PLCC kunye ne-QFP zinomthamo omkhulu wobushushu kunecandelo le-discrete chip, kwaye kunzima kakhulu ukuwelda iinxalenye zendawo enkulu kunamacandelo amancinci.
Ukufumana iziphumo eziphindaphindiweyo kwinkqubo yokuthengiswa kwe-lead-free reflow soldering, ubukhulu becala lomthwalo, kuba nzima ngakumbi.Ngokuqhelekileyo umthamo omkhulu womthwalo wee-oveni ezingenalo i-lead-free reflow ranges ukusuka kwi-0.5-0.9.Oku kuxhomekeke kwiimeko zeemveliso (icandelo le-soldering density, substrates ezahlukeneyo) kunye neemodeli ezahlukeneyo zokufudumeza kwakhona.Ukufumana iziphumo ezilungileyo ze-welding kunye nokuphindaphinda, amava asebenzayo abalulekile.
Ixesha lokuposa: Nov-21-2023