Sonke sinethemba lokuba inkqubo ye-SMT igqibelele, kodwa inyaniso ikhohlakele.Oku kulandelayo lulunye ulwazi malunga neengxaki ezinokwenzeka zeemveliso ze-SMT kunye nemilinganiselo yazo.
Okulandelayo, sichaza le miba ngokweenkcukacha.
1. Isiganeko seTombstone
I-Tombstoneing, njengoko kubonisiwe, yingxaki apho amacandelo ephepha aphakama kwicala elinye.Esi siphene singenzeka ukuba ukunyanzeliswa komphezulu kumacala omabini inxalenye ayilingani.
Ukuthintela oku kungenzeki, singenza:
- Ixesha elongeziweyo kwindawo esebenzayo;
- Lungiselela uyilo lwephedi;
- Ukuthintela i-oxidation okanye ukungcoliswa kweziphelo zecandelo;
- Ukulinganisa iiparamitha zeeprinta ze-solder kunye noomatshini bokubeka;
- Phucula uyilo lwetemplate.
2. Ibhulorho ye-Solder
Xa i-solder paste yenza uxhulumaniso olungaqhelekanga phakathi kwezikhonkwane okanye amacandelo, ibizwa ngokuba yibhulorho ye-solder.
Amanyathelo okulwa aquka:
- Lungiselela umshicileli ukulawula imilo yoshicilelo;
- Sebenzisa i-solder paste kunye ne-viscosity echanekileyo;
- Ukuphucula i-aperture kwi-template;
- Lungiselela ukukhetha kunye nokubeka oomatshini ukulungisa indawo yecandelo kunye nokusebenzisa uxinzelelo.
3. Iindawo ezonakeleyo
Amalungu anokuba neentanda ukuba zonakaliswe njengemathiriyeli ekrwada okanye ngexesha lokubekwa kunye nokuhamba kwakhona
Ukuthintela le ngxaki:
- Hlola kwaye ulahle izinto ezonakalisiweyo;
- Gwema unxibelelwano lobuxoki phakathi kwamacandelo kunye noomatshini ngexesha lokucubungula i-SMT;
- Lawula izinga lokupholisa ngaphantsi kwe-4 ° C ngesekhondi.
4. umonakalo
Ukuba izikhonkwane zonakaliswe, ziya kuphakamisa iipads kwaye inxalenye ayinakuthengiseka kwiipads.
Ukuthintela oku, kufuneka:
- Jonga izinto zokulahla iindawo ezinezikhonkwane ezimbi;
- Hlola iindawo ezibekwe ngesandla phambi kokuba uzithumele kwinkqubo yokubuyisela kwakhona.
5. Isikhundla esingalunganga okanye ukuqhelaniswa kwamalungu
Le ngxaki ibandakanya iimeko ezininzi ezinjengokungalungelelanisi kakuhle okanye ulungelelwaniso olungalunganga/ipolarity apho amalungu adityaniswe kumacala achaseneyo.
Amanyathelo okuchasa:
- Ukulungiswa kweeparamitha zomatshini wokubeka;
- Khangela iindawo ezibekwe ngesandla;
- Gwema iimpazamo zoqhagamshelwano ngaphambi kokungena kwinkqubo yokubuyisela kwakhona;
- Lungisa ukuhamba komoya ngexesha lokuqukuqela kwakhona, elinokuthi livuthele inxalenye kwindawo yayo echanekileyo.
6. Ingxaki yokucola i-solder
Umfanekiso ubonisa iimeko ezintathu ezinxulumene nomthamo we-solder paste:
(1) I-solder engaphezulu
(2) I-solder enganelanga
(3) Akukho solder.
Kukho izinto ezi-3 ezibangela ingxaki.
1) Okokuqala, imingxuma yetemplate inokuvalwa okanye ingalunganga.
2) Okwesibini, i-viscosity ye-solder paste ayinakuchaneka.
3) Okwesithathu, ukungahambi kakuhle kwe-solderability yamacandelo okanye iipads kunokubangela ukungonelanga okanye akukho solder.
Amanyathelo okuchasa:
- itemplate ecocekileyo;
- Ukuqinisekisa ulungelelwaniso olusemgangathweni lweethemplethi;
- Ulawulo oluchanekileyo lomthamo we-solder paste;
- Lahla amacandelo okanye iipads ezine-solderability ephantsi.
7. Amalungu e-solder angaqhelekanga
Ukuba amanye amanyathelo okudibanisa ahamba kakubi, i-solder joints iya kwenza iimilo ezahlukeneyo kunye nezingalindelekanga.
Imingxuma yestensile engachanekanga inokubangela (1) iibhola ze-solder.
I-Oxidation yeepads okanye amacandelo, ixesha elaneleyo kwisigaba sokucwina kunye nokunyuka ngokukhawuleza kweqondo lokushisa lokufudumeza kwakhona kunokubangela iibhola ze-solder kunye (2) nezimbobo ze-solder, ukushisa okuphantsi kwe-solder kunye nexesha elifutshane le-solder lingabangela (3) ii-icicles ze-solder.
Amanyathelo okuthintela ami ngolu hlobo lulandelayo:
- itemplate ecocekileyo;
- Ukubhaka ii-PCBs phambi kokulungiswa kwe-SMT ukuphepha i-oxidation;
- Lungisa ngokuchanekileyo ubushushu ngexesha lenkqubo ye-welding.
Ezi zingentla ziyiengxaki eziqhelekileyo zomgangatho kunye nezisombululo ezicetywayo ngumenzi we-reflow soldering we-Chengyuan Industry kwinkqubo ye-SMT.Ndiyathemba ukuba iya kuba luncedo kuwe.
Ixesha lokuposa: May-17-2023