Umvelisi we-reflow soldering u-Chengyuan ufunyenwe kwimveliso yexesha elide kunye nokuvelisa ukuba izizathu eziphambili ze-reflow solder bead zilandelayo:
1. Umgangatho we-soldering ubukhulu becala kuxhomekeke kwi-solder paste
Umxholo wesinyithi kwi-paste ye-solder, iqondo le-oxidation ye-powder yensimbi, kunye nobukhulu be-powder yensimbi inokuchaphazela ukuveliswa kweebhola ze-solder.
2. Umnatha wensimbi unempembelelo enkulu
a.Ukuvulwa kwestencil
Uninzi lweefektri ziya kuvula i-stencil ngokobungakanani bepadi, ukuze kube lula ukuprinta i-solder paste kumaleko e-solder kunye nokuvelisa amaso e-tin, ngoko ke kungcono ukuba nokuvulwa kwe-stencil encinci kunobukhulu bokwenyani. .
b.Ukutyeba komnatha wentsimbi
I-stencil Baidu ikholisa ukuba phakathi kwe-0.12 ~ 0.17mm, ukutyeba kakhulu kuya kubangela "ukudilika" kwe-solder paste, okukhokelela kumaso e-tin.
3. Uxinzelelo lokubeka umatshini wokubeka
Ukunyuka kukuba ukuba uxinzelelo luphezulu kakhulu, i-solder paste iya kucudiswa kwi-solder resist layer, ngoko ke uxinzelelo olunyukayo alufanele lube lukhulu kakhulu.
Ixesha lokuposa: Apr-06-2023