I-AOI-SPI
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JUKI 3D solder umatshini wokuhlola intlama, 3D ibhodi ebonwayo umatshini wokuhlola RV-2-3DH(AOI/SPI)
Isantya esiphezulu
Uphuculo olukhulu kubuchule bokuhlola ngepixel ephezulu (izigidi ezili-12 zeepikseli)
Ukuchaneka okumangalisayo
Ukusebenzisa iilensi ezinokulungiswa okuphezulu kuphucula ukuchaneka kokuhlolwa kwezixhobo ze-ultra-compact
Ukulula kokusetyenziswa kokureyitha
Iindlela zenkqubo ekulula ukuzisebenzisa kunye nokwenza, ukusuka kwabaqalayo ukuya kubantu abadala
Ukuhlola okuzenzekelayo okuzenzekelayo
RV series, enokusetyenziswa kwakhona umlinganiselo
Ukuphucula ukusebenza kakuhle kwesityalo sonke
Ukuphumeza ukusebenza kakuhle komzi-mveliso uphela ngonxibelelwano lwenkqubo
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JUKI 3D solder umatshini wokuhlola intlama, 3D umatshini wokuhlola ibhodi ebonakalayo (AOI/SPI) RV-2-3D
Ukuqonda ukukhawulezisa ngeyunithi yamva nje ye-3D.Ukuphumelela kwe-0.41 sec / FOV kunye ne-34% yokuphucula xa kuthelekiswa nemodeli yangaphambili.
Isisombululo sobude 0.1 μm, Ukuphindaphindwa kwe-10 μm *Ukuqonda ukuphuculwa okuchanekileyo okuchanekileyo.Ngophuhliso olutsha lweteknoloji, fumana umfanekiso we-3D ocacileyo kunye nochanekileyo.
Ukongeza kwithempleyithi ye-2D yangaphambili kunye nemo yenkqubo, yongezwe imowudi yetemplate ye-3D entsha.
Ngapha koko, ukuphuhliswa kwe-algorithm entsha yokuhlolwa kweefayili.* 0402 itshiphu
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JUKI 3D solder paste wokuhlola umatshini RV-2
ISixokelelwano esicacileyo sokubamba umbono
Umgangatho ophezulu wokusebenza kwehlabathi
Isantya sokuhlola = 0.2 sec / isakhelo
Udweliso lwenkqubo olulula
I-CCC ( Ulawulo loQinisekiso olusembindini)*
I-SPC ( Ulawulo lweNkqubo yoBalo) *
Ixhasa ukuhlolwa kwe-3D *